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John Zou
Tongxin Microelectronics Co., Ltd., EVP
Speaker Bio
John graduated from Tsinghua University with a master's degree in Integrated Circuits and has over ten years of experience in the IC industry.
He has participated in national-level projects, including the Core Electronic Devices, High-end Generic Chips and Basic Software Project and the NRDC Financial Project, and has obtained multiple national invention patents. John and his team have achieved various international authoritative certifications, including CC EAL6+ security certification and GSMA SAS-UP wafer-level personalization, which are both China's first. He is committed to promoting the global application of Chinese security chips in fields such as communication, finance and automotive electronics. Under his leadership, TMC TONGXIN MICRO has established a strong presence in the global SIM card market and become the first Chinese chip designer to commercialize eSIM solutions globally.
