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Gongjin Microelectronics, the world's first OSAT service platform dedicated to assembly calibration and testing services in the sensor field, leads the industry's innovative development with its exceptional technology and forward-looking vision. We have an advanced R&D center and production base of 24,000 square meters, including 10,000 square meters of Class 100, Class 1000 and Class 10,000 clean rooms, and has built a production line for sensor assembly, calibration and testing.
Through advanced testing equipment and efficient solutions, we conduct comprehensive calibration and testing for a wide range of sensors, including inertial, pressure, magnetic, environmental, acoustic, optical, radio frequency, and microfluidic sensors.
To meet the business needs for sensor calibration and testing, GJM has established a comprehensive sensor assembly capability, covering the entire process from wafer grinding, cutting, die bonding, wire bonding, coating, lid attach, reflow, molding, marking, and singulation. A variety of product packaging types are available, including LGA, QFN, SIP, and Die-to-Wafer wafer-level packaging. Over time, we have accumulated extensive experience in sensor assembly technologies related to stress management, airtightness, thermal conductivity, and weak signal isolation, enabling us to cater to the sensor assembly requirements of various application fields.
Through advanced testing equipment and efficient solutions, we conduct comprehensive calibration and testing for a wide range of sensors, including inertial, pressure, magnetic, environmental, acoustic, optical, radio frequency, and microfluidic sensors.
To meet the business needs for sensor calibration and testing, GJM has established a comprehensive sensor assembly capability, covering the entire process from wafer grinding, cutting, die bonding, wire bonding, coating, lid attach, reflow, molding, marking, and singulation. A variety of product packaging types are available, including LGA, QFN, SIP, and Die-to-Wafer wafer-level packaging. Over time, we have accumulated extensive experience in sensor assembly technologies related to stress management, airtightness, thermal conductivity, and weak signal isolation, enabling us to cater to the sensor assembly requirements of various application fields.