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GSMA Summits at MWC26 Shanghai
2026 Summits
AI Beyond Boundaries Summit
For: Telecom operators, enterprise solution architects, B2B strategists and digital transformation leaders.
What: Explore how operators are evolving from connectivity providers to builders of intelligent digital ecosystems — unlocking new B2B growth across healthcare, education, public services, retail and hospitality through AI-powered solutions.
Why it matters: The "5G + AI" fusion is creating a once-in-a-generation opportunity for operators to move up the value chain — but only if they build the right architectures now.
Key topics:
- AI-to-Business (AItoB) architectures – integrated connectivity-compute-AI service models designed for enterprise scale.
- 5G and AI best practices – global operator case studies demonstrating successful cross-industry innovation.
- New revenue models – commercial opportunities and challenges in delivering high-value AI-driven B2B solutions.
- Scalable implementation – frameworks for enterprise AI adoption that operators can deploy and monetise.
- Ecosystem partnerships – how operators collaborate with vertical industries to co-create intelligent services.
Platinum Sponsor
Gold Sponsor
AI Device Summit
For: Device manufacturers, chipset designers, app developers and UX innovators.
What: Explore how smartphones, PCs, wearables, emerging devices are becoming intelligent endpoints — delivering real‑time, personalised and context‑aware experiences through on‑device AI, new hardware architectures, and smarter device collaboration.
Why it matters: Devices are evolving from standalone products into intelligent, connected participants in larger ecosystems. As AI‑enabled devices and agents begin to coordinate across endpoints and networks, delivering seamless, secure and reliable experiences becomes a new design and engineering challenge.
Key topics:
- Hardware evolution – AI‑optimised chips, NPUs and system‑level design for smarter devices
- Device intelligence – real‑time perception, context awareness and low‑latency decision‑making
- Agent devices – the rise of the agent device and on‑device agents coordinating tasks
- Multi‑device intelligence – how devices work together across ecosystems and platforms
- Cross‑device orchestration – interoperability, handoff and coordination across endpoints
- System‑level challenges – privacy, latency, battery life and data boundaries
- Telco role – connectivity, edge computing and orchestration supporting intelligent device ecosystems
Platinum Sponsor
AI Ecosystem Summit
Embodied AI Summit
For: Robotics engineers, automation specialists, AI researchers, industrial operators, and infrastructure and connectivity leaders.
What: Explore how embodied AI is moving from breakthrough research to realworld deployment across factories, warehouses and commercial environments. Learn how robots and intelligent machines are being engineered, connected and scaled, and also what is truly working in production today.
Why it matters: As embodied AI systems move from labs into real operations, the focus shifts from innovation to deployment, reliability and ROI. Scaling embodied intelligence depends on the right system architectures, data strategies and connectivity, while safety and ethics frameworks evolve alongside the technology.
Key topics:
- Scaling embodied AI from pilots to realworld deployment
- Robotics foundation models including vision language action systems for real environments
- Humanoid vs nonhumanoid systems focusing on practicality, cost and impact
- System architecture and engineering choices for deployment at scale
- Perception, multimodal models and motion control
- Human robot interaction enabling safe and intuitive collaboration
- Data strategy and continuous learning for performance improvement
- Connected robotics and realtime coordination
- Enterprise readiness and paths to ROI in the physical AI economy
Platinum Sponsor
Gold Sponsor
eSIM Summit
For: Mobile operators, device manufacturers, eSIM platform providers and IoT ecosystem leaders.
What: Explore how eSIM is reshaping China’s connectivity landscape, unlocking new models across consumer and enterprise markets. Industry leaders address the challenges and opportunities that lie ahead as eSIM becomes a standard in China’s mobile ecosystem.
Opportunity in China: The start of China's eSIM era marks a tipping point—expect rapid adoption across all device categories and new business models to follow.
Key topics:
- China's eSIM milestone – from wearables and IoT to full smartphone deployment.
- Ecosystem collaboration – how operators, OEMs and vendors aligned to make it happen.
- Consumer electronics expansion – rapid integration across tablets, wearables and connected devices.
- IoT at scale – seamless connectivity for industrial, automotive and smart city applications.
- What's next – challenges, opportunities and standards as eSIM becomes the mobile default.
Platinum Sponsor
Gold Sponsors
Future Networks Summit
Intelligent Data Centre Summit
IoT Summit
For: IoT platform providers, industrial engineers, smart city planners and enterprise IT leaders
What: Explore the next phase of IoT—where connectivity meets AI, edge computing and digital twins to create intelligent systems that sense, analyse and act in real time.
Opportunity in China: ROI-driven deployments require data interoperability and industrial-scale IoT—China's manufacturing and smart city ecosystems provide real-world blueprints.
Key topics:
- AI-powered platforms – moving from connected devices to intelligent, autonomous systems.
- Edge analytics – real-time inference at the point of data collection, not the cloud.
- Digital twins – virtual replicas optimising infrastructure, cities and industrial operations.
- Massive IoT + RedCap – Scaling low-cost, low-power connectivity for billions of endpoints.
- Security and lifecycle management – protecting devices from deployment through decommissioning.
Gold Sponsor
Mobile AI Monetisation Summit
NTN (Non-Terrestrial Networks) Summit
For: Satellite operators, mobile network operators, aerospace innovators and connectivity strategists.
What: Discover how satellites, HAPS and aerial platforms are merging with terrestrial networks to deliver seamless global coverage—especially critical for resilience, mobility and remote access.
Opportunity in China: It’s rapidly expanding its space-based connectivity ambitions, positioning itself as a major global player in spacebased infrastructure.
Key topics:
- Multi-orbit integration – LEO, MEO, and GEO satellites working as one network.
- 3GPP standards evolution – the roadmap for NTN interoperability and direct-to-device connectivity.
- Hybrid architectures – seamless handoffs between terrestrial and satellite networks.
- Mission-critical use cases – maritime, aviation, rural connectivity and disaster recovery.
- Spectrum & business models – regulatory frameworks and commercial pathways for NTN services.
Platinum Sponsor
Gold Sponsor
Smart Manufacturing Going Global Summit
For: Factory operators, industrial engineers, supply chain leaders and automation specialists.
What: Discover how AI, automation and digitalised factory systems are reshaping global manufacturing — transforming production lines into flexible, resilient, software-defined environments.
Opportunity in China: China's industrial digitalisation momentum is creating practical blueprints for intelligent, high-efficiency manufacturing at an unprecedented scale.
Key topics:
- AI-driven optimisation – intelligent manufacturing execution, predictive quality control and adaptive scheduling.
- Embodied AI and robotics – next-generation autonomous systems with real-world perception and decision-making.
- Human-machine collaboration – augmented workforce technologies that enhance productivity and safety.
- Industrial edge intelligence – OT-IT system integration bringing real-time analytics to the factory floor.
- Advanced verticals – breakthrough applications in semiconductor fabrication, battery production and precision manufacturing.
Platinum Sponsor
Smart Mobility Summit
For: Automotive engineers, aviation innovators, urban planners and mobility service providers
What: Explore how AI, connectivity and next-gen transportation are reshaping movement on the ground and in the sky—from autonomous vehicles and C-V2X coordination to eVTOLs and intelligent drone networks.
Opportunity in China: Smart vehicle deployment nationwide while scaling low-altitude pilot zones are scaling — creating the world's testbed for autonomous, integrated mobility.
Key topics:
- In-vehicle AI – large models powering smart cockpits and cloud-edge-vehicle intelligence integration.
- Autonomous commercialisation – robotaxis, logistics fleets and intelligent transport services hitting the road.
- 5G-Advanced for mobility – precise positioning, situational awareness and real-time vehicle coordination.
- Urban air mobility – eVTOL development, intelligent flight systems and autonomous navigation.
- Low-altitude infrastructure – drone applications (inspection, logistics, public safety) plus safety regulation and traffic management.
- Integrated networks – air-ground-cloud communication enabling multidimensional transport ecosystems.
Gold Sponsor
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Cygnusemi delves into 5G/6G satellite internet communication technologies and strives for integrated air-space-ground-sea converged communication. We look forward to co-innovating with industry partners to build a new ecosystem of full-scenario smart connectivity, empower the future intelligent world and realize ubiquitous connections.
Simon Lin
CTO of Shanghai Cygnus Semiconductor Co., Ltd.
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TMC TONGXIN MICRO has deeply participated in eSIM specification development and achieved global commercial deployment of its eSIM products, fulfilling the vision of "One Chip, One World". We look forward to working with global partners in mobile communications and building a new ecosystem for smart connectivity!
John Zou
EVP of Tongxin Microelectronics Co., Ltd.
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As AI inference scales, every millisecond of latency matters to the user experience. Whether powering cloud infrastructure or enabling diverse edge applications, YMTC’s innovative memory solutions continuously boost inference efficiency, maximizing the value of every single token.
Titus Lo
SVP, YMTC (Yangtze Memory Technologies Co., Ltd.)