GSMA Summits at MWC26 Shanghai
2026 Summits
AI Beyond Boundaries Summit
AI Device Summit
Embodied AI Summit
eSIM Summit
Future Networks Summit
Intelligent Data Centre Summit
IoT Summit
Manufacturing & Production Summit
Mobile AI Summit
NTN (Non-Terrestrial Networks) Summit
Smart Mobility Summit
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TMC TONGXIN MICRO has deeply participated in eSIM specification development and achieved global commercial deployment of its eSIM products, fulfilling the vision of "One Chip, One World". We look forward to working with global partners in mobile communications and building a new ecosystem for smart connectivity!
John Zou
EVP of Tongxin Microelectronics Co., Ltd.