GSMA Summits at MWC25 Shanghai

Gain deep insights into the future of our industry and showcase your ideas, products or solutions by taking part.

Thank you!

We hope that the event was enjoyable and look forward to welcoming you back to Shanghai in 2026.

  • At the forefront of technological innovation, TMC is driving the democratisation and ecosystem transformation of eSIM technology through highly secure, highly reliable high-performance chip architectures. From wearable devices to seamless satellite communication handovers, TMC collaborates with global partners to push the boundaries of computing-network convergence and quantum encryption.

    John Zou Tongxin Micro, EVP

Explore the summits

Use the tabs below to find which summits have been announced so far. If you are interested in taking part or would like to talk to our sales team about hosting your own presentation, please contact us.

  • The consumer embedded SIM revolution is underway in China, with STMicroelectronics playing a pivotal role. As a leader in this technology, ST has already deployed over 1 billion ST33 eSIM units worldwide. Discover our ST33 and ST54 solutions tailored for the Chinese market, supported by ST’s investments in our ‘in China, for China’ program and our active participation in eSIM standardization with TAF.

    Laurent TRICHEUR Head of Marketing & Application, Connected Security Division, MDRF, China, STMicroelectronics